Specific requirements are as follows:
-Experience with the packaging of electronics systems intended to be used in severe thermal and dynamic environments.
-Knowledge of materials and processes relevant to aerospace electronics.
-Experience with contemporary solid modeling tools such as Unigraphics NX.
-Knowledge of design techniques for high voltage systems -Experience with FEM thermal and structural analysis tools such as ANSYS Workbench.
-Experience with Thermal Desktop and Icepak (nice to have) -Knowledge of environmental test of aerospace electronics.
BS Degree preferably in Mechanical, Aeronautical or Electrical Engineering plus six years minimum of design/development engineering experience.
Optional: Masters Degree, preferably in Mechanical, Aeronautical or Electrical Engineering plus three years of design/development engineering experience.